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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging : Materials, Processes, Equipment, and Reliability
eBook
Springer <editore>
2019
VAN17@Biblioteca del Dipartimento di Scienze e Tecnologie Ambientali Biologiche e Farmaceutiche
BIBLIOTECA DEL DIPARTIMENTO DI SCIENZE E TECNOLOGIE AMBIENTALI BIOLOGICHE E FARMACEUTICHE
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BIB 2113/52 |
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CONS e-book 2113 52
https://unina2.on-line.it/opac/resource/VAN00126018?locale=eng
